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19-1553; Rev 0; 9/99
MAX3831/MAX3832 Evaluation Kits
General Description
The MAX3831/MAX3832 evaluation kits (EV kits) simplify evaluation of the MAX3831/MAX3832 2.488Gbps interconnect mux/demux ICs with clock generator. The EV kits require only a +3.3V single supply and include all the external components necessary to interface with 3.3V CML and LVDS logic. A parallel data generator or stimulus system can be used with an oscilloscope to evaluate the chip's complete functionality. A built-in system test (BIST) function allows a system high-speed test. The MAX3831/MAX3832 EV kits contain an on-board clock and data recovery IC (MAX3876EHJ) that is used to generate 2.488Gbps clock and data inputs to the high-speed, CML-compatible serial-input ports. o +3.3V Single Supply o On-Board Clock and Data Recovery (CDR) o Fully Assembled and Tested Surface-Mount Board o Loss-of-Frame/Loss-of-Lock Monitors
Features
Evaluate: MAX3831/MAX3832
Component Suppliers
SUPPLIER Coilcraft Sprague PHONE 847-639-6400 207-324-4140 FAX 847-639-1469 603-224-1430 PART MAX3831EVKIT MAX3832EVKIT *Exposed paddle
Ordering Information
TEMP. RANGE 0C to +85C 0C to +85C IC PACKAGE 64 TQFP-EP* 64 TQFP-EP*
Note: Please indicate that you are using the MAX3831 or MAX3832 when contacting these component suppliers.
Component List
DESIGNATION QTY C1 C2-C5, C7-C14, C18, C22, C24-C28, C31-C33, C35, C36, C43-C47, C52-C56, C59-C62 C23 C29 C30 R4, R60 R30, R33, R36, R39, R71 R28, R29 1 DESCRIPTION 0.33F 10%, 16V min ceramic capacitor (0805) DESIGNATION QTY R61, R62 L1, L2, L4, L5, L6 38 0.1F 10%, 25V min ceramic capacitors (0603) D2, D3 J1, J2, J33-J36 J7, J8, J15-J32 J38 1 1 1 2 0 2 1.0F 10%, 16V min ceramic capacitor (0805) 33F 10%, 10V min tantalum cap Sprague 293D336X0016D2 2.2F 10%, 10V min ceramic capacitor (1206) 390 5% resistors 100 1% resistor (0603)-- not placed 4.99k 1% resistors JP3 JP4, JU2, JU3, JU7 +3.3V, GND U1 U2 U3 None None None 0 5 2 6 20 1 1 4 2 1 1 1 2 1 1 DESCRIPTION 49.9 1% resistor (0603)-- not placed 56nH inductors Coilcraft 0805CS-560XKBC LEDs SMA connectors (PC mount) SMB connectors (PC mount) 2x12 header (0.1in centers) 3-pin header (0.1in centers) 2-pin headers (0.1in centers) Test points MAX3831UCBor MAX3832UCB 64-pin TQFP-EP MAX3876EHJ (32-pin TQFP) 74HCT04 Shunts for JP3 and J38 MAX3831/MAX3832 PC board MAX3831/MAX3832 data sheet 1
________________________________________________________________ Maxim Integrated Products
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.
MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
Quick Start
1) Apply 3.3V to the +3.3V pin. Connect power-supply ground to GND. 2) Short TEST to ground by tying pins 9 and 10 of J38 together. This places the chip into test mode, with PRBS data transmitted to the serial- and paralleldata output ports. 3) Reset the elastic store buffer by shorting pins 5 and 6 of J38. 4) Remove the jumper from pins 5 and 6 of J38; the LOF indicator (D3) should turn off. 5) Use a high-speed, 50 input oscilloscope to monitor PDO_ and SDO for a proper eye diagram. 50 probe, balance the circuit by connecting the other output with a 50 terminator to ground.
Connecting LVDS Outputs to High-Impedance Oscilloscope Inputs
To monitor an LVDS signal with a high-impedance oscilloscope probe, install a 100 differential load resistor between the complementary outputs (see R30, R33, R36, R39, R71 in the Component List).
Connecting CML Outputs to High-Impedance Oscilloscope Inputs
To monitor a CML signal with a high-impedance instrument, install 49.9 1% pull-up resistors (see R61 and R62 in the Component List) between the respective output lines and VCC.
Detailed Description
Connecting LVDS Outputs to 50 Oscilloscope Inputs
To monitor an LVDS signal with a 50 oscilloscope probe, leave the coupling capacitors in series with the outputs. If you are observing only one output with a
Exposed-Paddle Package
The exposed-paddle (EP), 64-pin TQFP incorporates features that provide a very low thermal resistance path for heat removal from the IC. The paddle is electrical ground on the MAX3831/MAX3832 and should be soldered to the circuit board for proper thermal and electrical performance.
DESCRIPTION
Table 1. Controls, Test Points, and LEDs
NAME JU2 JU3 JU7 JP4 JP3 TYPE 2-pin header 2-pin header 2-pin header 2-pin header 3-pin header PIN 1, 2 1, 2 1, 2 1, 2 1, 2 2, 3 1, 2 3, 4 5, 6 7, 8 9, 10 J38 24-pin header 11, 12 13, 14 15, 16 17, 18 19, 20 21, 22 23, 24 D2 D3 LED LED 1, 2 1, 2 RCLKI common-mode bias connection. Shorting JU2 to ground sets VCM = 0 (allows a single-ended RCLK input). LOF test point (before buffering). Do not short. LOF test point (after buffering). Do not short. Loss-of-Lock (LOL) test point. Do not short. Short to enable system-loopback input to CDR. Short to enable serial-data input to CDR. TRIEN--short to enable tristate mode. PLBEN--short to enable parallel-system-loopback mode. RSETES--short to reset elastic store buffers. LBEN--short to enable serial-line-loopback mode. TEST--short to enable BIST mode. N/A N/A RSETFR--short to reset frame-sync circuitry. LOF test point. Do not short. N/A N/A N/A LOL indicator*
LOF indicator *LOL indicates serial data is not locked. Note that the LOL monitor is only valid when a data stream is present on the inputs of the MAX3876. 2 ________________________________________________________________________________________
2x12HEADER J38 2 TRIEN_N PLBEN_N RSETES_N LBEN_N TEST_N C4 0.1F C61 0.1F JU2 J21 PDO1+ R28 4.99k R29 4.99k C59 0.1F C60 0.1F 4 6 8 10 12 14 RSETES_N PLBEN_N 16 RSETFR_N LOF_N C1 0.33F C7 0.1F VCC VCCPLL 18 20 22 24 VCC VCC 64 GND 63 FIL+ 62 FIL61 GND 60 V CC 59 RSETES 58 RCLKI+ 57 RCLKI56 VCC 55 PLBEN 54 PDI1+ 53 PDI152 PDI2+ 51 PDI250 GND 49 R36 100 1% C5 0.1F R39 100 1% J22 PDO1-
J32 RCLKI+ J31 RCLKIJ30 PDI1+ J29 PDI1J28 PDI2+ J27 PDI2J26 PDI3+ J25 PDI3J24 PDI4+ J23 PDI4-
1
3
5
7
9
11
13
15
17
17 VCC 18 N.C. 19 N.C. 20 N.C. 21 N.C. 22 N.C. 23 N.C. 24 VCC 25 GND 26 N.C. 27 N.C. 28 GND 29 GND 30 RSETFR 31 LOF 32 GND
Figure 1. MAX3831/MAX3832 EV Kits Schematic
J19 PDO2+ C9 0.1F J20 PDO2C3 0.1F VCCOUT R61 49.9 48 47 C10 0.1F J17 PDO3+ VCCOUT LBEN_N
19
21
23
+3.3V
J1 C47 SDO0.1F
+3.3V
U1 MAX3832
J2 SDO+ SDVCC C44 0.1F VCC SCLK+ SCLK-
C8 0.1F
R62 49.9
TEST_N SD+
R33 100 C12 1% 0.1F
J18 PDO3-
VCC J15 PDO4+ 0.1F C13 R30 100 1%
J7 PCLKOC45 0.1F R71 100
1 GND 2 VCC 3 SDO4 SDO+ 5 VCC 6 LBEN 7 TEST 8 SDI+ 9 SDI10 VCC 11 SCLKI+ 12 SCLKI13 VCC 14 PCLKO15 PCLKO+ 16 GND PDI3+ 46 PDI345 PDI4+ 44 PDI443 GND 42 PDO1+ 41 PDO140 PDO2+ 39 PDO238 VCC 37 PDO3+ 36 PDO335 PDO4+ 34 PDO433 TRIEN
J8 PCLKO+ VCC
J16 PDO4-
TRIEN_N JU3 U3A 2 VCC 1 RSETFR_N 74HCT04 74HCT04 13 LOF_N U3F 12
0.1F C14 JU7 R4 390 D3 +3.3V
Evaluate: MAX3831/MAX3832
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= OPTIONAL COMPONENT
MAX3831/MAX3832 Evaluation Kits
3
Evaluate: MAX3831/MAX3832
ALL DECOUPLING CAPS WILL BE LOCATED NEAR THEIR OUT PINS. L1 56nH C24 0.1F C25 0.1F C26 0.1F C28 0.1F C43 0.1F C62 0.1F VCC
J33 VCCCDR SDIJ34 VCCCDR 1 2 JP3 3 SLBI ENABLE VCCCDR C11 0.1F
GND FIL+ FILGND PHADJ+ PHADJGND LOL
GND GND VCC SLBI+ SLBIVCC
VCC GND
MAX3831/MAX3832 Evaluation Kits
J36
SLBI-
C22 0.1F
VCCCDR
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VCCPLL +3.3V J49 +3.3V 1 C29 2 33F C30 2.2F L6 56nH C35 0.1F VCCCDR L2 56nH C46 0.1F C52 0.1F C53 0.1F C54 0.1F C55 0.1F C56 0.1F C36 0.1F VCCOUT C32 0.1F L5 56nH C33 0.1F J50 GND VCCVCO L4 56nH C31 0.1F VCCCDR D2 C27 0.1F R60 390 JP4 C23 1F 32 31 30 29 28 27 26 25 SDI+ C2 0.1F VCCCDR SD+ SDVCCCDR VCCCDR SCLK+ SCLKVCCCDR
J35
VCCCDR
VCCCDR
Figure 2. MAX3831/MAX3832 EV Kits Schematic (continued)
U2 MAX3876
1 2 3 4 5 6 7 8 GND GND VCC SDI+ SDIVCC SIS GND 9 10 11 12 13 14 15 16 GND VCC SDO+ SDOVCC VCC SCLKO+ SCLKOVCC 24 23 22 21 20 19 18 17 SLBI+ SDI ENABLE C18 0.1F
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
1.0"
Figure 3. MAX3831/MAX3832 EV Kits Component Placement Guide--Component Side
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
1.0"
Figure 4. MAX3831/MAX3832 EV Kits PC Board Layout--Component Side
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
1.0"
Figure 5. MAX3831/MAX3832 EV Kits PC Board Layout--Solder Side
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
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Figure 6. MAX3831/MAX3832 EV Kits PC Board Layout--Power Plane
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
1.0"
Figure 7. MAX3831/MAX3832 EV Kits PC Board Layout--Ground Plane
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
1.0"
Figure 8. MAX3831/MAX3832 EV Kits Component Placement Guide--Solder Side
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MAX3831/MAX3832 Evaluation Kits Evaluate: MAX3831/MAX3832
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